Apple’s iPhone 7 expected to be alot of thinner due to which company reportedly will remove 3.5 mm headphone jack.
For the replacement of the headphone jack company is expected to be giving new EarPods that plug into the Lightning port instead. According to Macotakara (Japanese blog), Apple’s engineers can make next year’s iPhone at least 1mm thinner.
It is very interesting to see how apple is able to slim a device, as in the current iphone 6s company designed a phone which bit thicker then the previous iphone 6 because the new iphone 6s accommodate company’s new 3D touch display.
Apple does not only needs to slim down its 3D touch display and headphone jack, But also needs to slim down some important parts like battery and camera without affecting the performance of them.
Apple has previously patented new headphone jack designs that are slimmer than the existing standard, which could be one option.